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Electron Microscopy Sciences

Equipment

arrow14EMS300T D Dual Target, Large Chamber, Turbo-Pumped Sputter Coater

offerBuy a new unit today and get a $500 credit towards the purchase of any accessories we offer.




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    Standard rotating specimen stage - for 4” wafers or individual SEM mounting stubs. Shown with optional dual-channel film thickness monitor
  • IMG 2078
    Optional specimen stage for glass microscope slides and dual-channel film thickness monitor option
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    Optional specimen stage for glass microscope slides and dual-channel film thickness monitor option
  • IMG 2080
    Rotary planetary stage and dual-channel film thickness monitor - both Q300T D options
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    Rotary planetary stage and dual-channel film thickness monitor - both Q300T D options
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    Standard rotating specimen stage with 4” wafer and optional dual-channel film thickness monitor
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    Lockable emergency stop (e-stop) switch option. NB: Does not inhibit or replace the normal on/off switch function
 

Quick Overview

The EMS300T D is a fully automatic, free-standing sputter coater ideally suited for thin film applications and for conductive coating of scanning electron microscopy (SEM) specimens.

At the operational heart of the EMS300T D is a large chamber fitted with two independent sputtering heads. This “dual-head” configuration allows two different metals to be sequentially sputtered without the need to “break” vacuum. A dual channel film thickness monitor option is available.

The system is designed to sputter a wide range of metals, both non-oxidising (noble) metals such as gold (Au), gold (Au) and platinum (Pt) and oxidising metals such as chromium (Cr) and aluminium (Al).

The EMS300T D sputter coater has a 300 mm x 127 mm work chamber. The specimen stage accepts substrates of 2”, 3” or 4” wafer sizes as standard and 6” wafers with an optional stage accessory. An optional extended height glass chamber is available to enable coating of larger specimens.

Key Features

  • Fully automatic touch screen control - rapid data input, simple operation
  • Dual sputter head – for sequential sputtering of two different metals
  • Customer defined coating protocols
  • Wide range of oxidising and non-oxidising targets available
  • Fine grain sputtering for advanced high resolution FE-SEM applications
  • Large chamber format
  • Coat logging - details of the last 100 coatings available on screen
  • Optional dual channel film thickness monitor (FTM) module
  • High vacuum turbo pumping - allows sputtering of a wide range of oxidising and non-oxidising metals - suitable for SEM, high resolution FE-SEM and also for many thin film applications
  • Automatic vacuum control - can be pre-programmed to suit the process and material - no needle valve to adjust
  • Vacuum shut-down feature - leaves the process chamber under vacuum when not in use giving improved vacuum performance
  • Thick film capabilities - up to 60 minutes sputtering time without breaking vacuum
  • Ergonomic one-piece moulded case - easy maintenance and service access
  • Ethernet with local FTP server connection - simple programme updates
  • Power factor correction - complies with the current legislation (CE Certification) - efficient use of power means reduced running costs
  • Three-year warranty

Product Description

Ideal for thin film applications or for sputter coating large specimens for SEM/FE-SEM

The EMS300T D is suited for sputtering a range of oxidising and non-oxidising (noble) metals for scanning electron microscopy (SEM) and thin film applications. The range of target materials available is extensive and detailed in the Ordering Information section below. The EMS300T D sputter coater comes with a chromium (Cr) and a gold (Au) target as standard.

High vacuum turbo molecular pumping

The EMS300T D is fitted with an internally mounted 70L/sec turbomolecular pump, backed by a 50L/m two-stage rotary pump (ordered separately). A Pirani vacuum measurement gauge (range: 1000 mbar to 5 x 10-4 mbar) is included, but a full range gauge (1000 mbar to 5 x 10-9 mbar) is available as an option. Typical ultimate vacuum of around 5 x 10-5 mbar can be expected in a clean system after pre-pumping with dry nitrogen gas.

Dual head sputtering – for sequential sputtering

The EMS300T D is fitted with two independent sputtering heads to allow sequential sputtering of two different metals without the need to break vacuum. For example, a thin “seeding” layer of chromium followed by a deposition of gold. An automatic shutter mechanism is fitted to enable cleaning of oxidising sputter targets and to protect the second target and substrate during coatings. For single metal coating applications an individual target can be selected.

Specimen stages

The EMS300T D is fitted with a flat rotating specimen stage capable of accepting wafers up to 4” (102 mm) in diameter. The rotation speed is variable between preset limits and the stage to sputtering head distance can be adjusted between 25 mm and 71 mm. A range of optional specimen stages can also be fitted, please see the Options and Accessories section.

Moulded case with colour touch-screen

The EMS300T D is presented in a custom moulded, one-piece case, allowing for easy servicing and access. The colour touch screen enables user control of the coater functions (on various administrative levels) and multiple users to input and store coating ‘recipes’. The case houses all the working components and includes an automatic bleed control that ensures optimum vacuum conditions during sputtering. The vacuum chamber has an internal diameter of 283 mm/12” and comes with an integral implosion guard. The EMS300T D can also be fitted with the optional facility for vacuum shutdown, which enhances vacuum performance by allowing the chamber vacuum to be maintained when the system is not in use.

Rapid data entry

At the operational heart of the EMS300T D is a simple colour touch screen, which allows even the most inexperienced or occasional operator to rapidly enter and store their own process data. To further aid ease of use, a number of typical sputter coating profiles are already stored. For added convenience summaries of the last 100 coatings carried out can be viewed on the touch screen.

Maintenance

The intuitive touch screen interface features maintenance prompts which highlight:

  • Time of last clean
  • Coating time since last cleaned
  • System “on time‟
  • Time of last service

Additional Information

Options and Accessories (including details the standard specimen stage)

Specimen stages

The EMS300T D has specimen stages to meet most requirements. All are easy-change, drop-in style (no screws) and are height adjustable (except rotary planetary stage). Rotation speed is variable between 14 and 38 rpm:

  • Flat rotation stage for 4” (102 mm) wafers - fitted as standard
  • Flat rotation stage for 6” (152 mm) wafers
  • Rotation stage - 50 mm Ø. This stage only rotates - no tilt or height adjustment
  • Rotate-tilt stage - 50 mm Ø with height adjustment (target to stage height variable between 30-80 mm). The tilt angle can be pre-set (horizontal to 30 degrees)
  • Rotation stage for glass microscope slides
Other Options
  • Extended height chamber – for taller specimens
  • Dual channel film thickness monitor (FTM) - the optional FTM attachment consists of a controller and quartz crystal oscillator built into the EMS300T D and a vacuum feed-through, two chamber-mounted crystal holders and quartz crystals. As sputtered material is deposited onto the crystal its frequency of oscillation is modified, this ‘modification’ is used to measure and control the thickness of material deposited

Specifications

Instrument case 585 mm W x 470 mm D x 410 mm H (total height with coating head open-710 mm)
Weight 36.4kg
Packed dimensions 725 mm W x 660 mm D x 680 mm H (44.8kg)
Work chamber Borosilicate glass 283 mm ID x 127 mm H
Safety shield Integral polyethylene terephthalate (PET) cylinder
Display 145 mm x 320 mm x 240 mm colour graphic thin film transistor (TFT) display
User interface Intuitive full graphical interface with touch-screen menus and buttons, includes features such as a log of the last 100 coatings carried out and reminders for when maintenance is due
Sputter target Disc style 57 mm Ø with thickness depending upon the targets fitted. Three 57 mm Ø x 0.3 mm thick chromium (Cr) targets (TK8845) are fitted as standard.
Vacuum
High vacuum pumping Internally-mounted, 70L/s air-cooled turbomolecular pump
Rotary pump 50L/m two-stage rotary pump with oil mist filter.
Vacuum measurement Pirani gauge (a full range gauge is available as an option)
Typical ultimate vacuum 5x10-5mbar in a clean system after pre-pumping with dry nitrogen gas
Specimen stage Flat rotation stage for 4” (102 mm) wafers is fitted as standard. Rotation speed is variable between preset limits. For alternative stages see Options and Accessories 
Processes
Sputtering 0-80 mA to a pre-determined thickness (with optional FTM) or by the built-in timer. The maximum sputtering time is 60 minutes (without breaking vacuum and with built-in rest periods)
Services and other information
Gases Argon sputtering process gas, 99.999% Nitrogen venting gas (optional)
Electrical supply 90-250V 50/60Hz 1,400VA including RV3 rotary pump power. 110/240V voltage selectable
Conformity CE conformity: Power factor correction. Complies with the current legislation (CE Certification) and ensures efficient use of power, which means reduced running costs

Ordering Information

offerBuy a new unit today and get a $500 credit towards the purchase of any accessories we offer.

EMS300T D Dual-Head, Large-Chamber-Turbo-Pumped Sputter Coater, supplied with 1 x 57 mm Ø x 0.3 mm chromium (Cr) and 1 x 57 mm Ø x 0.1 mm thick gold (Au) target. A flat rotation stage for 6” (152 mm) wafers is included. POR Quote
Rotary pump requirements (needs to be ordered separately)
91003 Edwards RV3 50L/s two-stage rotary pump, with vacuum hose, coupling kit and oil mist filter $2324.00 Add to Cart
6550 Diaphragm pump. A “dry” alternative to the standard 91003 oil-based rotary pump complete with vacuum hose, coupling kit and oil mist filter POR Quote
Specimen stages
6790-S Swinging arm stage drive, a stage drive and positioning mechanism which positions the stage under the correct target. Also provides rotation drive to the stage. Rotation Speed Max 38 rpm Min 14 rpm POR Quote
6800-S Rotating specimen stage for 6” (152 mm) wafers, with rotation variable between preset limits. POR Quote
6801  Rotating 50 mm Ø specimen stage with adjustable tilt. The platform has six specimen stub positions for 15 mm, 10 mm, 6.5 mm or 1/8" pin stubs. The stage rotation speed is variable between preset limits. The target to stage height is variable between 0 mm and 42 mm for the standard stage. When used with the extended height cylinder the target to stage height would be an additional 87 mm. POR Quote
6802 50 mm Ø variable height specimen stage with six stub positions for 15 mm, 10 mm, 6.5 mm disc stubs or 1/8" pin stubs. Stage rotation speed variable between preset limits. Note: Target to stage height is variable between 10 mm and 53 mm for the standard stage. The stage is supplied with two mounting pillars; one provides 10 mm to 32 mm target to stage distance and the other 31 mm to 53 mm. An adjustable stop is used to set the height. When used with the extended height cylinder (optional accessory) the target to stage height would be an additional 87 mm. POR Quote
6803 50 mm Ø rotary tilting stage. A rotary planetary style stage with a variable tilt angle from horizontal to 30 degrees. The platform has six positions for either 6.5 mm, 10 mm and 15 mm disc stubs or 1/8" pin stubs. Rotation speed is variable between preset limits. Note: depending upon specimen height, this stage may require the optional extended height cylinder. POR Quote
6804 A 90 mm Ø specimen stage for glass microscope slides (up to two 75 mm x 25 mm slides or a single 75 mm x 50 mm slide). The stage can alternatively accommodate up to six 1/8” SEM pin stubs. The stage rotation speed is variable between preset limits. A gear box is included to allow the optional FTM to be used. POR Quote
Options and accessories
6805 Dual channel film thickness monitor (FTM). A fully integrated system using the Q300T D touch screen display for the control and display of all FTM functions. The FTM allows for the automatic termination of the metal sputtering process at a pre-selected thickness value. The rate for the sputtering processes is displayed in nm/min, with a resolution of 0.1 nm. Two FTM crystal holders are fixed in the chamber to give optimal position for both targets and to coat one material per crystal. Operating crystal frequency is in the 5 MHz to 400 kHz operating range. Includes two spare quartz crystals POR Quote
6806 Spare quartz crystal. POR Quote
6807 Extended height vacuum chamber (214 mm in height, the standard chamber is 127 mm high). Ideal for increased source to specimen distance and for coating of larger specimens. POR Quote
6808 Vacuum spigot allows more convenient connection of the vacuum hose to the rear of the Q300T D when bench depth is limited. POR Quote
6809 A lockable emergency stop (e-stop) switch which can be mounted on top of the system in a position easily accessible for the operator. It is provided with a key to release the knob after activation. Note: the addition of the e-stop does not inhibit or replace the normal On/Off switch function. The e-stop can be retrofitted to existing systems. POR Quote
6810 Full range, active vacuum gauge capable of measurement over the range of 1000 mbar to 5 x 10-9 mbar. Typical ultimate vacuum of the Q300T D is 5 x 10-5 mbar. Note: this must be factory fitted. POR Quote
6811 Coating shields. Can be fitted to protect large surfaces from coating deposition and can be easily removable for cleaning. POR Quote
6812 Spares kit, including: spare standard glass cylinder, one chromium (Cr) and one  (Au) sputtering target, vacuum tubing with coupling insert, argon gas tubing, two sputter head magnets, rotary pump oil mist filter, FTM quartz crystal and fuses. POR Quote
Sputter targets

NB: The EMS300T D is fitted with a 57 mm diameter 0.3 mm thick chromium (Cr) target and a 57 mm diameter 0.1 mm thick gold (Au) target as standard. Other optional targets are available:

3410 57mm Ø x 0.1mm Gold POR Quote
3411 57mm Ø x 0.1mm Gold/Palladium (80/20) POR Quote
3412 57mm Ø x 0.1mm Platinum POR Quote
3413 57mm Ø x 0.1mm Nickel POR Quote
3414 57mm Ø x 0.1mm Silver POR Quote
3415 57mm Ø x 0.1mm Palladium POR Quote
3416 57mm Ø x 0.1mm Copper POR Quote
3417 57mm Ø x 0.3mm Chromium POR Quote
3418 57mm Ø x 0.5mm Tungsten POR Quote
3419 57mm Ø x 1.5mm Chromium POR Quote
3420 57mm Ø x 0.2mm Tungsten POR Quote
3421 54mm Ø x 1.5mm Carbon POR Quote
3422 57mm Ø x 0.1mm Aluminium POR Quote
3423 57mm Ø x 0.1mm Platinum/Palladium (80/20) POR Quote
3424 57mm Ø x 1.5mm Titanium POR Quote
3425 57mm Ø x 0.3mm Platinum/Palladium (80/20) POR Quote
3426 57mm Ø x 0.3mm Gold POR Quote
3427 57mm Ø x 0.3mm Gold/Palladium (80/20)

POR

Quote
3428 57mm Ø x 0.3mm Platinum POR Quote
3429 57mm Ø x 0.5mm Titanium POR Quote
3430 57mm Ø x 0.1mm Iron POR Quote
3431 57mm Ø x 0.3mm Iridium POR Quote
3432 57mm Ø x 0.1mm Cobalt POR Quote
3433 57mm Ø x 0.1mm Tin POR Quote
3434 57mm Ø x 0.1mm Molybdenum POR Quote
3435 57mm Ø x 0.3mm Magnesium POR Quote
3436 57mm Ø x 0.1mm Tantalum POR Quote
3437 57mm Ø x 3mm Indium Tin Oxide (90/10) POR Quote

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