French Flag   chineseFlag   japaneseFlag   germanFlag   SpanishFlag   argentinaFlag   mexicoFlag   russianFlag

View Cart || Request a 2017 Catalog

Electron Microscopy Sciences

Materials Science and Metrology

arrow14Micro Cleaving

arrow12Model 520 - MicroCleave Kit

The MicroCleave technique is a relatively simple and inexpensive method of producing superior cross sectional TEM specimens. For speed in preparation, it is unsurpassed. One limitation of the technique is that it does require the substrate material to be cleaved or fractured. For this reason, it has been applied almost exclusively to semiconductor materials. Recently, the technique has been extended to other substrates, such as glass, silicon carbide, quartz, sapphire, and other hard materials. It is particularly well suited for rapidly examining coatings and thin films very soon after they are deposited.

MicroCleave Kit

Features:

  • Relatively simple and inexpensive method for the preparation of TEM cross sections, where specific information is not required.
  • Ideal when sample availability is limited as it requires very little starting material.
  • No ion milling is required. Therefore, no amorphization, no heating effects, no ion implantation, and no preferential sputtering.
  • The MicroCleave sample is ideally suited for rapid crystallographic orientation and determination in the TEM.
  • The MicroCleave technique is fast and typically requires preparation times of less than 1 hour. This makes it particularly well suited for rapid examination of coatings and thin films shortly after deposition.

Ordering:

50130-20 Model 520 MicroCleave Complete Kit 6100.00 Add to Cart

msdsComplete Kit Includes:

50130-50 Model 150MC Lapping Fixture each 2255.00 Add to Cart
50130-51 #5201 Grid Bending Jig with Cover each 165.00 Add to Cart
50130-52 Engraved Mounting Block for 150MC 3/pk 61.00 Add to Cart
50130-53 "PTFE" Block each 20.00 Add to Cart
50130-54 Post-it Block each 13.00 Add to Cart
50130-55 Lantern Slide each 17.00 Add to Cart
50162-80 Model 180 Lapping Tray each 495.00 Add to Cart
50162-81 Angle Guide for Model 180 each 99.00 Add to Cart
50130-56 Silicone Mat each 13.00 Add to Cart
70030 Coarse Scribe each 12.00 Add to Cart
62107-ST Micro Scribe 15/pk 26.00 Add to Cart
50130-59 Tab Grid (100/pk) 5/pk 45.00 Add to Cart
71700 Lens-Tissue each 17.50 Add to Cart
50130-60 Transparent Ruler 5/pk 10.00 Add to Cart
60968 Tri-pour Beaker with Lid, 50 ml, 10/pk each 28.00 Add to Cart
50130-61 Petri Dish with Mounted Slide each 48.00 Add to Cart
50130-62 Petri Dish with lids 5/pk 19.00 Add to Cart
71140 100-position Grid Storage Box each 15.75 Add to Cart
50130-63 Silver Epoxy each 168.00 Add to Cart
66100-20 Red Sable Brush, Size 2/0 each 8.00 Add to Cart
50130-64 Mixing Tray (Aluminum Dish), 10/pk each 10.00 Add to Cart
72350 Hot/Stirrer Plate each 605.00 Add to Cart
50160-25 Cooling Tray each 579.00 Add to Cart
72703-D Tweezers #5, 45 Degree Bent 5/pk 32.00 Add to Cart
50419-20 Quick Stick - Mounting Wax each 73.00 Add to Cart
50130-66 Lint-Free Cloth, size 4 x 4", 10/pk each 10.00 Add to Cart
50350-35 Diamond Lapping Film, 30 micron each 32.00 Add to Cart
50130-67 Squeegee each 10.00 Add to Cart
50130-21 Model 520-B - Basic MicroCleave Basic Kit 3500.00 Add to Cart

Basic Kit Includes:

50130-50 Lapping Fixture, Model 150MC each 2700.00 Add to Cart
50130-51 #5201 Grid Bending Jig with Cover each 200.00 Add to Cart
50130-52 Engraved Mounting Block for 150MC 3/pk 75.00 Add to Cart
50130-53 "PTFE" Block 5/pk 25.00 Add to Cart
50130-54 Post-it Block each 16.00 Add to Cart
50162-80 Model 180 Lapping Tray each 495.00 Add to Cart
50130-61 Petri Dish with Mounted Slide each 35.00 Add to Cart
50162-81 Angle Guide for Model 180 each 99.00 Add to Cart

References:

  1. Ultramicroscopy, 38 (1991) 149, John P. McCaffrey.
  2. TEM Samples of semiconductors Prepared by a Small-Angle Cleavage Technique, J.P. McAffrey, Materials Research Society, Vol. 254 (1992).
  3. Microscopy Research and Technique, 24 91993) 180, j. p. McCaffrey.
  4. A simplified Method for Modifying TEM Copper Grids for Use with Small Angle Cleavage Technique, Microscopy Today (96-4) (1996, Scott D. Walck.
  5. The Small Angle Cleavage Technique: An Update, Scott D. Walck and John McCaffrey. Materials Research Society, Vol. 480 (1997).

Silicon Wafer Cleaving System arrow12arrow12