Micro
Cleaving

Model
520 - MicroCleave Kit
The MicroCleave technique is a relatively simple and inexpensive method of producing superior cross sectional TEM specimens. For speed in preparation, it is unsurpassed. One limitation of the technique is that it does require the substrate material to be cleaved or fractured. For this reason, it has been applied almost exclusively to semiconductor materials. Recently, the technique has been extended to other substrates, such as glass, silicon carbide, quartz, sapphire, and other hard materials. It is particularly well suited for rapidly examining coatings and thin films very soon after they are deposited.
FEATURES:
- Relatively simple and inexpensive method for the preparation of TEM cross sections, where specific information is not required.
- Ideal when sample availability is limited as it requires very little starting material.
- No ion milling is required. Therefore, no amorphization, no heating effects, no ion implantation, and no preferential sputtering.
- The MicroCleave sample is ideally suited for rapid crystallographic orientation and determination in the TEM.
- The MicroCleave technique is fast and typically requires preparation times of less than 1 hour. This makes it particularly well suited for rapid examination of coatings and thin films shortly after deposition.
Ordering:
| 50130-20 | Model 520 MicroCleave | Complete Kit | 6100.00 |
Complete Kit Includes:
| 50130-21 | Model 520-B - Basic MicroCleave | Basic Kit | 3500.00 |
Basic Kit Includes:
References:
- Ultramicroscopy, 38 (1991) 149, John P. McCaffrey.
- TEM Samples of semiconductors Prepared by a Small-Angle Cleavage Technique, J.P. McAffrey, Materials Research Society, Vol. 254 (1992).
- Microscopy Research and Technique, 24 91993) 180, j. p. McCaffrey.
- A simplified Method for Modifying TEM Copper Grids for Use with Small Angle Cleavage Technique, Microscopy Today (96-4) (1996, Scott D. Walck.
- The Small Angle Cleavage Technique: An Update, Scott D. Walck and John McCaffrey. Materials Research Society, Vol. 480 (1997).


