Micro
Cleaving
Model
520 - MicroCleave Kit
The MicroCleave technique is a relatively simple and inexpensive method
of producing superior cross sectional TEM specimens. For speed in preparation,
it is unsurpassed. One limitation of the technique is that it does
require the substrate material to be cleaved or fractured. For this
reason, it has been applied almost exclusively to semiconductor materials.
Recently, the technique has been extended to other substrates, such
as glass, silicon carbide, quartz, sapphire, and other hard materials.
It is particularly well suited for rapidly examining coatings and thin
films very soon after they are deposited.
Features:
- Relatively simple and inexpensive method for the preparation of
TEM cross sections, where specific information is not required.
- Ideal when sample availability is limited as it requires very little
starting material.
- No ion milling is required. Therefore, no amorphization, no heating
effects, no ion implantation, and no preferential sputtering.
- The MicroCleave sample is ideally suited for rapid crystallographic
orientation and determination in the TEM.
- The MicroCleave technique is fast and typically requires preparation
times of less than 1 hour. This makes it particularly well suited
for rapid examination of coatings and thin films shortly after deposition.
Ordering:
| 50130-20 |
Model 520 MicroCleave |
Complete Kit |
6100.00 |
Add to Cart |
Complete Kit Includes:
| 50130-21 |
Model 520-B - Basic MicroCleave |
Basic Kit |
3500.00 |
Add to Cart |
Basic Kit Includes:
| 50130-50 |
Lapping Fixture, Model 150MC |
each |
2700.00 |
Add to Cart |
| 50130-51 |
#5201 Grid Bending Jig with Cover |
each |
200.00 |
Add to Cart |
| 50130-52 |
Engraved Mounting Block for 150MC |
3/pk |
75.00 |
Add to Cart |
| 50130-53 |
"PTFE" Block |
5/pk |
25.00 |
Add to Cart |
| 50130-54 |
Post-it Block |
each |
16.00 |
Add to Cart |
| 50162-80 |
Model 180 Lapping Tray |
each |
495.00 |
Add to Cart |
| 50130-61 |
Petri Dish with Mounted Slide |
each |
35.00 |
Add to Cart |
| 50162-81 |
Angle Guide for Model 180 |
each |
99.00 |
Add to Cart |
References:
- Ultramicroscopy, 38 (1991) 149, John P. McCaffrey.
- TEM Samples of semiconductors Prepared by a Small-Angle
Cleavage Technique, J.P. McAffrey, Materials Research Society, Vol.
254 (1992).
- Microscopy Research and Technique, 24 91993) 180, j. p. McCaffrey.
- A simplified Method for Modifying TEM Copper Grids for Use with
Small Angle Cleavage Technique, Microscopy Today (96-4) (1996,
Scott D. Walck.
- The Small Angle Cleavage Technique: An Update, Scott D. Walck and
John McCaffrey. Materials Research Society, Vol. 480 (1997).
