Dimpler for TEM Specimen Preparation
The Model D500i Dimpler has become an indispensable tool for TEM specimen preparation. The dimpling technique, which is applicable to a myriad of material types, yields a higher quality specimen with a broader, near electron transparent area which reduces ion milling times. The Model D500i automates the dimpling technique so that the most demanding specimen can be dimpled to < 10 microns routinely and repeatedly. Real time measurement of tool height, specimen thickness, and tool run out allow the user to precisely control the dimpling process. With the proper tooling and parameter adjustment, the dimpling technique with the D500i can be completed with ease.
The Model D500i is a precision electro-mechanical metallographic lapping instrument. It will continuously monitor and cotnrol dimpling parameters and accurately terminate at a preset specimen thickness. This breakthrough in electronic and mechanical integration has added repeatability and reliability to the dimpling process, as well as automation.
Several operating functions of the Model D500i are built in to facilitate repeatable, usuable dimpled samples.
The Z position display indicates the termination set point and the dimple depth from the Non-Contact Sensor and is both analog and digital. The analog elliptical bar displays the Z Position of the arm in real time so tool run out and damping effects can be monitored. The digital LED display in microns is updated once every tool revolution by the Tool Phase Detector at the same angular site. This negates any error due to tool run out, especially significant when using padded tools.
Four factors improve the termination accuracy:
- Non-Contact Position Sensor
- Tool Phase Sensor
- No external measuring device
- Magnetically coupled arm damping
The Non-Contact Position Sensor measures the location of the fulcrum arm which corresponds precisely to the thickness of the specimen.This sensor has an accuracy of better than one micron. Since it is non-contacting there are no detrimental effects on the action of the fulcrum arm. The reaction time of the sensor is fast enough to terminate the dimpling process the first time the Tool Phase Sensor indicates that the Z termination set point has been reached. Specimen thickness is measured directly on the D500i with the tool surface as the measuring point. The dimple depth and the Z termination set point are measured with the same reference. This prevents any measurement error from being translated directly to a termination error.
Damping of the arm is accomplished by using position information from the Non-Contact Position Sensor, processing it and feeding it back to the arm motor, which controls the up/ down force of the arm. The position snesor and the processing circuit is fast enough to actively dampen any vibration the arm may experience. Since the damping force is magnetically coupled to the arm there is no mechanical play in the system, allowing damping response on the sub-micrometer level. Damping is adjustable from zero damping to stiff damping.
Damping offers three significant attributes:
- Vibrations that can crack thin specimens are greatly reduced.
- Keeps tools round, negating escess impacts, providing more accurate Z position control.
- Tool gently contact the specimen when the arm is lowered.
Automated features make the dimpling process more repeatable and easy to use. Tools are raised and lowered at the touch of a button; dimpling force, damping force, fine balance, and Z offset (termination point) all are set from the front panel.
Once dimpling has begun no monitoring is necessary. After the initial specimen thickness has been measured, the specimen is mounted an dthe user simply selects a dimple depth and begins dimpling.The precise Z position of the tool/surface interface is continuously displayed while dimpling with any tool. When the selected dimple depth is reached the D500i controls will automatically raise the arm then stop the tool rotation, specimen rotation, and clock timer.
Specimens are mounted on optically smooth sapphire flats. Low thermal mass of the flat reduces mounting and dismounting times and the smooth surface allows the dimpled specimens to be gently slipped off. The hardness of sapphire limits damage if specimens are accidentally dimpled through due to operator error. The retainer ring which secures the sapphire flat also serves as a slurry reservoir. A specimen mounting jig is used for specimen centering during mounting. For off center dimples a special Eccentric Platen with a centering microscope is available.
Tools 1i and 2i are flatting tools and Tools 3i and 4i are dimpling tools. Tools 2i and 4i are supplied pre-padded with various types of metallographic polishing pad. In addition to saving the user the time of padding tools the machine formed padded tools have TIR (Total Indicator Reading) approaching Tools 1i and 3i. Dimpling tool geometries have been improved, so that Dimpling Tools 3i and 4i will produce 380 micron diameter dimpled areas.
Research has indicated that Tools 2i and 4i have a working diameter within the nap of the pad. Whereas the DZ (change in Z offset value) between the specimen and the hard tool surface is virtually zero, the DZ between the “working interface” and the specimen is a function of dimpling force, tool speed, damping force, and pad compliance. After the dimpling force, tool speed, and damping force are selected, the working diameter will stabilize at the working interface of the pad. This working interface is monitored on the Z display and used as a reference location from which a specimen is to be dimpled further. A user can control the dimple depth and removal with a virtually seamless padded tool. This position control allows the dimpling force to approach zero within 1 gram increments.
Example of a silicon based integrated circuit device prepared using the Model D500i Dimpler. The image shows the excellent uniformity obtainable using the dimpling technique.
|Z Offset:||Accuracy:||1 micron|
|Z Termination Accuracy:||Tools 1i/3i:||< +/- 1 micron|
|Tools 2i/4i:||< +/- 2 microns|
|Tool Force:||Range:||1 - 200 grams|
|1 gram steps|
|Tool Speed:||100 - 600 RPM|
|Specimen Platen Speed:||10 RPM|
|Tool Shaft:||0.5 micron TIR|
|Tools:||Tools 1i/2i:||+/- 1 micron TIR|
|Tools 3i/4i:||+/- 2 micron TIR|
|Platen Surface:||< 0.5 micron TIR|
|Electrical:||120 VAC / 60 Hz|
|240 VAC / 60 Hz|
|50170-500i||Dimpler – Model D500i||each||22,000.00||Add to Cart|
|50170-40||Alignment Microsocpe||each||1,795.00||Add to Cart|
|50170-42||Magnetic Platen Assembly||each||550.00||Add to Cart|
|50170-41||- Magnetic Platen (Base standard tools)||each||204.00||Add to Cart|
|50170-21||- Adjustable Platen||each||140.00||Add to Cart|
|50170-03||- Magnetic base||each||225.00||Add to Cart|
|50170-04||MEP Centering Stand (for use with magnetic base)||each||225.00||Add to Cart|
|50170-06||Sapphire Flat (x2) size 3/4” Dia x 0.53mm||each||79.00||Add to Cart|
|50170-07||Specimen Mounting Jig Assembly||each||78.00||Add to Cart|
|50170-17||Shim Control Lapping Fixture||each||747.00||Add to Cart|
|50170-18||Shim Control Lapping Fixture (can be replaced by option 1 or 2*)||each||902.00||Add to Cart|
|50170-22||D500i Holder Transferable to Model 141 (Need to have MEP)*||each||140.00||Add to Cart|
|50170-23||Micarta Tool||each||49.00||Add to Cart|
|50170-08||Tool 1i Flat||each||64.00||Add to Cart|
|50170-09||Tool 2iM Flat Polishing||each||95.00||Add to Cart|
|50170-10||Tool 2iT Flat Polishing||each||95.00||Add to Cart|
|50170-11||Tool 3i Dimpling||each||95.00||Add to Cart|
|50170-12||Tool 4iM Dimple Polishing||each||95.00||Add to Cart|
|50170-13||Tool 4iT Dimple Polishing||each||95.00||Add to Cart|
|50170-14||3µm Diamond Suspension, 2 oz.||each||120.00||Add to Cart|
|50170-15||1µm Diamond Suspension – Poly, 2 oz.||each||120.00||Add to Cart|
|50170-16||Lapping Vehicle, 4 oz||each||16.00||Add to Cart|
|50419-20||Mounting Wax, QuickStick135||each||73.00||Add to Cart|
|50170-19||Knob Thumb Screw||each||20.00||Add to Cart|
|50170-20||Allen Wrench Set (1/16 – 3/16)||each||22.00||Add to Cart|
|50150-50||Option 1: Model 150 Lapping Fixture||each||2,600.00||Add to Cart|
|50172-01||Standard Specimen Platen Assembly||each||725.00||Add to Cart|
|50172-02||Quick Release Platen Assembly (used with one of four bases listed below)||each||600.00||Add to Cart|
|50172-03||Fixed Base (for standard tools)||each||200.00||Add to Cart|
|50172-04||Magnetic Base (for standard tool)||each||230.00||Add to Cart|
|50172-05||Fixed Base for Large Area Tools||each||200.00||Add to Cart|
|50172-06||Magnetic Base for Large Area Tools||each||230.00||Add to Cart|
|50172-07||MEP Centering Stand (for use w/magnetic base)||each||230.00||Add to Cart|
|50172-08||MicroSaw – includes diamond cutting wheel and support collar assembly||each||325.00||Add to Cart|
|50170-40||Alignment Microsocpe||each||1,795.00||Add to Cart|
|50170-55||Video alignment Tool||each||4,500.00||Add to Cart|
|50170-50||Specimen Vice (for X-sectional prep, includes "PTFE" jaws)||each||747.00||Add to Cart|
|50173-01||Sapphire Flat||each||61.00||Add to Cart|
|50173-02||Tool 1i Flat||each||60.00||Add to Cart|
|50173-03||Tool 2iM Flat Polishing||each||152.00||Add to Cart|
|50173-04||Tool 2iT Flat Polishing||each||152.00||Add to Cart|
|50173-05||Tool 3i Dimpling||each||152.00||Add to Cart|
|50173-06||Tool 4iM Dimple Polishing||each||152.00||Add to Cart|
|50173-07||Tool 4iT Dimple Polishing||each||152.00||Add to Cart|
|50173-08||Tool 3i Dimpling Cooper||each||159.00||Add to Cart|
|50173-09||Tool 1iD - 15µm Diamond Flatting||each||295.00||Add to Cart|
|50173-10||Tool 1iD - 9µm Diamond Flatting||each||295.00||Add to Cart|
|50173-11||Tool 1iD - 6µm Diamond Flatting||each||295.00||Add to Cart|
|50173-12||Tool 1iD - 3µm Diamond Flatting||each||295.00||Add to Cart|
|50173-13||Tool 3iD - 3µm Diamond Flatting||each||295.00||Add to Cart|
|50173-14||Tool 3iD - 1µm Diamond Flatting||each||295.00||Add to Cart|
|50173-15||Tool 3iD – 0.25µm Diamond Flatting||each||295.00||Add to Cart|
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