Sample Grinding and Sectioning

Premium
Pregrinding Wet or Dry Abrasive Papers (Discs)
We offer the finest wet or dry abrasive discs for sample preparation with the following features:
- Premium Resin Bonding System for longer wear rates as well as for wet or dry operation.
- Special adhesive on PSA* backed discs that eliminates the need to transfer to plates.
- Uniform mineral size.
- Pull tabs on all PSA backed discs for easy use.
- Large labels for easy product identification.
- PSA: Pressure Sensitive Adhesive
Available in 9 different grit sizes, ranging from coarse to fine, on plain back or water resistant pressure sensitive adhesive back.
Available in 8" diameter discs as a standard, and 12" discs available upon request.

Premium
Abrasive Cut-off Wheels for Sectioning
Aluminum Oxide and Silicon Carbide Abrasive Cut-Off Wheels are offered for long life, and are affordably priced for various sectioning requirements. All wheels are 9" (228.6mm) diameter 0.062” (1.6mm) thick; 1¼” (31mm) arbor.
9" Diameter Cut-Off Wheel
For General Purpose, 5" Diameter Cut-Off Wheel
(Silicon/Carbide) is the most common disc.
| 50205-10 | 5" General Purpose Cut-Off Wheel | 10/pk | 91.00 |

Diamond Discs
Dialok Diamond Discs consists of a flat, stainless steel backing with sharp, blocky diamond particles electroformed onto the disc. The special hard nickel alloy that is used in Dialok is bonded rigidly and it locks the diamond particles in the disc thus providing fast cutting of all hard materials. The sharp particles cut cleanly with no edge rounding. The discs are supplied with pressure sensitive adhesive backing (PSA).
8 (203mm) (PSA) xN/H; Full Coat
Precision
Diamond Wafering Blades
(Precision Diamond Cut-Off Wheels)
These bonded blades are constructed of an inner metal core and an outer rim, this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements:
- High Concentration (H/C) for general laboratory use, either low or high saw’s speed.
- Low concentration (L/C) for sectioning hard and brittle materials, such as ceramics, silicon, glass, minerals.
Diamond Wafering Blade
Water Soluble Coolant
Use with a dilution 25:1 with water to cool saw blade or belt during cutting.
| 50378-01 | Water Soluble Coolant | 1 qt | 21.00 |
SiC Dressing Stick
Made from silicon carbide. Use for cutting blade dressing.
| 50379-01 | SiC Dressing Stick | 1 stick | 14.00 |

