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225 Silicon Cleaving System

LatticeAx®

Meet the LatticeAx® Product Line – an accurate, fast, low-cost cleaving solution, suitable for any lab. The LatticeAx® is a precision cleaver that fits in the palm of your hand. In an amazingly small footprint (4" cube, 100 mm³), the patent-pending "Ax" and process are designed to assist the user to cleave site specific targets, as well as wafers, strips, or pieces to precisely sized samples with localized targets. One of the smallest, most efficient silicon wafer cleaving tools in the world, the LatticeAx® is sure to revolutionize your workflow.

The LatticeAx® features and process optimize the very basic elements of the manual cleaving technique and help overcome manual cleaving disadvantages, such as lack of accuracy and repeatability. This machine-assisted hybrid cleaving tool bridges the gap between manual scribing and fully automated cleaving. It increases success rate by any user while keeping costs down. It takes little training and users will be "cleaving in minutes and experts in a day."

LatticeAx® – New Way of Cleaving

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LatticeAx is fundamentally different from manual cleaving because it:

  1. Replaces human vision with a high-magnification digital microscope to precisely select the target
  2. Replaces hand coordination with precision positioning knobs, resulting in a repeatable process that is not user-dependent
  3. Produces an indent on the surface <1 mm in length, ~10µm in width at a very shallow depth
  4. Employs a controlled "slow cleave" that follows the crystal plane, rather than a break along a scribed line

This machine-assisted hybrid cleaving tool bridges the gap between manual scribing and fully automated cleaving. It also increases success rate by any user while keeping costs down. Cleaving with the LatticeAx 225 and 420 products deliver 20 and 10µm targeting accuracy respectively. Cleaving is fast (<5 minutes), clean and repeatable.

While a manual scribe and cleave is fast (about 2 minutes), it is not repeatable or accurate. Accuracy can be improved when the manual scribe is made while viewing the sample with a stereoscope (50-100µm). In both cases, targeting accuracy and quality varies by user.

In the past decade, automated micro-cleaving tools improved targeting accuracy and sample quality needed for high resolution SEM imaging. These improvements came with strict pre-preparation requirements, lower throughput, inability to handle small and thin samples, and much higher cost than manual cleaving.

The LatticeAx features and process optimizes the very basic elements of the manual cleaving technique and overcomes manual cleaving disadvantages, such as lack of accuracy and repeatability.

  • Precision mechanics integrated with high resolution optics and independently controlled sample and indenter stages
  • LatticeAx indents. A shallow indent is made on the surface of the sample. No scribing
  • Clean and accurate cleaves in <5 minutes. No dust, just a straight, long cleave with a mirror finish

Fast – 5 Minute Process

  • Quick targeting with variable zoom
  • Digitally displayed real-time imaging

Versatile – wide range of sample size, substrate type and top layers

  • Si-GaAs-Sapphire
  • Cu
  • Resist
  • Polyimide
  • Passivation
  • Films

Applications

  • Site specific cross-section for SEM analysis
  • Target localization prior to FIB or broad ion beam
  • Downsize samples for SEM with height restriction
  • Cleaving to create uniform samples for other analysis tools with non-wafer scale stages
  • Vertical, mirror image cleaving for photonics analysis

Setup Requirements

  • Flat, stable surface to support the LatticeAx at least 18" x 24" or 41 cm x 61 cm surface space
  • Power for the vacuum pump (110V or 220V depending on local requirements)
  • Computer running Windows 7 or XP with mouse, keyboard, monitor, video cable to the monitor

Options

  • The Cleaving Station
  • Cleaving Kit
  • Marker-Scriber Kit
  • Lattice Scriber
  • CleanBreak Pliers

The Process

Using the LatticeAx, wafer cleaving is accomplished in three basic steps that compliment existing skill sets used in wafer analysis.

NEW! LatticeAx® 225

Accurate Indent and Cleaving System

The addition of high magnification imaging enables accurate indenting, resulting in samples cleaved with high accuracy. The LatticeAx 225 delivers 20µm accuracy with high quality cleaved surfaces in 5 min. It integrates the patent pending LatticeAx base with an industrial platform customized for indenting and cleaving.

The imaging package includes a focusing mount, a digital microscope with polarizer and real-time image acquisition and display software. With realtime imaging the indent is placed accurately with respect to the target making cleaving sample target simple and fast for all users. The 225 accepts samples with a wide range of sizes, thicknesses and materials.

The LatticeAx 225 combined with the Large Sample Platform for LatticeAx (EMS Cat #7653) is commonly used to downsize wafers up to 300 mm. It can indent and cleave cleanly, not generating excessive silicon dust and resulting in clean edges. Because of the accuracy of the indent die can be excised without loss of material.

The LatticeAx® 225 Features

  • ±20 Microns Cleaving Accuracy
  • Accurate and Repeatable Indent and Cleave
  • Clean and high quality mirror finish cleaved face
  • Simple to operate
  • No maintenance contracts

The LatticeAx® 225 Benefits

  • All the features of the LatticeAx 120 base tool
  • Robust workstation platform designed for indenting and cleaving
  • USB2 digital microscope with realtime digital imaging interface*
  • Microscope mount with fine focus control
  • Vacuum pump to secure sample with pneumatic valve switch

*Computer not included

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