Dimpler for TEM Specimen Preparation
Dimpler – Model 200
An easy-to-use, state-of-the-art, mechanical thinning instrument designed for the reproducible preparation of high-quality electron microscopy specimens.
Description
The Model 200 Dimpling Grinder is an easy-to-use, state-of-the-art, mechanical thinning instrument designed for the reproducible preparation of high-quality TEM specimens. The Model 200 features grinding rate control which determines the rate at which material is removed. Microprocessor-based control circuitry automatically and precisely terminates the grinding process when the desired specimen thickness is achieved. The Model 200 continuously indicates specimen thickness on an alphanumeric display with an accuracy of one micron. A 40x optical microscope facilitates precise specimen positioning as well as in-situ specimen observation. The specimen is illuminated by both transmission and reflected light.
Features
- Prethin specimens for ion milling
- Polish specimens to electron transparency
- Controlled grinding force and rate
- Vibration-free grinding
- Precise indication of specimen thickness
- Easy to program
- Accepts mounted specimens from the Model 160 Specimen Grinder
- Optional 40x microscope attachment allows direct observation of the specimen without the need to remove it
Ideal specimen prep for ion milling
The ultra-precise Model 200 Dimpling Grinder is indispensable when ion milling is used for final specimen thinning. Because the specimen is prethinned by dimpling, ion milling must remove only relatively small amounts of material. This creates specimens free from uneven thinning, surface defects, and irradiation damage.
Versatile
By simply changing tools, the dimpling grinder can be used to flat grind bulk specimens, dimple, and then finally polish the specimen to electron transparency.
Precise specimen positioning
A key component of the dimpling grinder is the specimen stage that precisely rotates the specimen. The specimen is mounted with a low melting point polymer to the top half of a two-piece platen. The platen fits into a magnetic base, which is coupled to the specimen stage by a rare-earth magnet. This magnetic coupling allows the base to be positioned so that a particular area of the specimen can be precisely placed under the grinding wheel. Positioning can be observed through a 40 X optical microscope.
The specimen can be readily removed for inspection and then precisely repositioned for continued grinding. Specimen rotation speed is continuously varied by a front panel mounted potentiometer.
Optimized grinding control
For effective preparation and to avoid specimen damage, an electromechanical stage lowers the grinding wheel at an optimized rate. This creates a very controlled reduction of specimen thickness.
Wear on the grinding wheel is uniform, virtually eliminating eccentric tool-induced vibration and ensuring grinding without the risk of specimen fracture.
At the conclusion of the grinding process, the advanced instrument control halts both the wheel and specimen rotation and then automatically lifts the grinding wheel from the specimen surface.
Vibration-free grinding
The precision fit of the grinding wheel to the shaft minimizes eccentricity. Both advanced rotary bearing technology and a specially designed drive system virtually eliminate wheel vibration. Grinding wheel rotation speed is continuously adjustable via a front panel mounted potentiometer.
The dimpling grinder can incorporate different types of wheels
- Grinding wheels for rapid material removal without scratching.
- Polishing wheels for an optimal surface finish.
- Wheels with different diameters for various dimple profiles. A variety of wheel materials are available and can be specially matched to given applications.
Controlled grinding force and rate
The grinding wheel stage is pivoted to present the grinding wheel to the specimen. It contains a micrometer-type, adjustable counterweight system to regulate the applied grinding force. The controlled grinding force and rate produces specimens with exceptional quality.
Easy programming
Programming is extremely easy via a keypad mounted on the front panel. Prompts guide you through quick and easy programming steps. A liquid crystal display continuously shows performance information.
A zero position can be established on either the surface of the platen or the surface of the specimen. This enables you to either dimple to a given thickness or to remove a specific amount of material from the specimen.
Process termination
Final specimen thickness is readily programmed for accurate, unattended operation. However, at any time, the process can be either paused for specimen inspection or stopped. During grinding, specimen thickness is continuously displayed.
The dimpling grinder also features a time-based polishing mode. At the conclusion of an elapsed set time, the process automatically terminates.
Transmitted or reflected illumination
The platen that holds the specimen has a glass center section that allows light to be transmitted through the specimen from a source located beneath the specimen stage. The intensity level of the transmitted light is adjustable for optimal specimen observation. This is particularly important when dimpling silicon, which undergoes changes in color as the specimen approaches electron transparency.
The dimpling grinder also features illumination with reflected light from a high intensity lamp, powered by the dimpling grinder's power supply.
Microscope for direct observation
A 40x microscope attachment allows direct observation without the need to remove the specimen.
Specifications
| Grinding Control | Automated grinding rate control, Grinding force adjustable with micrometer counterweight system, Independent control of grinding wheel and specimen rotation speeds |
| Specimen Stage | Precise specimen stage rotation, Magnetic mount allows easy specimen positioning |
| User Interface | All program inputs via front panel keypad, Specimen thickness indicated on a liquid crystal display |
| Specimen Illumination | Specimen observation in either transmitted or reflected light |
| Enclosure | Weight: 18 lb (8.2 kg), Size: 8.2 in (208 mm) width x 6.5 in (165 mm) height x 13.5 in (343 mm) depth |
| Power Requirements | 110/220 V AC, 50/60 Hz, 375 W |
| Warranty | One year |
Ordering
Model 200 Dimpling Grinder includes
- Aligning Ring, Magnetic Base
- Flattening Wheel, Micarta
- Grinding Wheel, Wood
- Platen, 0.75" Diameter (3)
- Platen Assembly, Glass
- Grinding Wheel, Micarta (3)
- Flattening Wheel, Stainless Steel
- Grinding Wheel, Stainless Steel (2)
- Grinding Wheel, Phospor Bronze
- Wheel Locking Nut
- Slurry Retainer Assembly
- Lamp Beam Block
- Wheel Hub Assembly
- Semiconductor Polishing Wheel
- Extended Base, Magnetic Platen
- Wrench, Ball End Hex Key, 1/16", Steel
| 50178 | Model 200 Dimpling Grinder, with country-specific power cord | each | 23,000.00 | Add to Cart |
Specimen Grinder – Model 160
Mechanically prethins specimens for transmission electron microscopy (TEM). Greatly reduces the time spent during the final preparation process of ion beam milling.
Description
The Model 160 Specimen Grinder is an accurate and dependable tool for mechanically prethinning specimens in preparation for transmission electron microscopy (TEM). The grinder accommodates up to 18 mm diameter specimens.
The specimen grinder greatly reduces the time spent during the final preparation process of ion beam milling, which is typically used to achieve electron transparency.
A graduated scale allows the specimen thickness to be easily and precisely controlled; rotating the control knob advances the specimen 0.5 mm per rotation.
The large diameter provides excellent stability. Specimens with uniform thickness and parallel sides are consistently produced because of the precise fit of the specimen platen into the grinder body. The grinder is heavy enough to provide sufficient grinding force on the specimen.
Features
- Accurate and dependable
- Precisely controlled
- Specimens up to 18 mm diameter
- Large diameter provides excellent stability
- No additional force needed
- Consistently produce specimens with uniform thickness and parallel sides
- Platen transferable to the Model 200 Dimpling Grinder
One-step mounting
If further thinning via dimpling is required, the platen containing the specimen is simply ejected from the specimen grinder and installed directly into the Model 200 Dimpling Grinder.
This eliminates any possibility of damaging the specimen by demounting it for dimpling.
Specifications
| Specimen Size | Up to 18 mm diameter |
| Dimensions | 3.0 in (76 mm) diameter x 2.6 in (66 mm) height |
| Weight | All program inputs via front panel keypad, Specimen thickness indicated on a liquid crystal display |
| Warranty | One year |
Ordering
Model 160 Specimen Grinder includes
- Platen, 0.75" Diameter (4)
- Platen Holder
| 50179 | Model 160 Specimen Grinder, with country-specific power cord | each | 2,150.00 | Add to Cart |
Options
| 50179-01 | Goniometer Platen | each | 2,007.00 | Add to Cart |
| 50179-02 | Specimen Lapping Kit | each | 4,027.00 | Add to Cart |
Model 180 XTEM Prep Kit
Produce High-Quality Cross Sections
The Model 180 XTEM Prep Kit is designed to produce controlled cross-section TEM (XTEM) specimens using rectangular wafers obtained from the area of interest of the bulk material.
Features
- Fabricate precise cross-section specimens for transmission electron microscopy
- Aligns areas and interface of interest
- Produces specimens with a high level of mechanical integrity
- Produces consistent glue layer thickness
- Stacks and holds cross-section specimens
- Resulting stacks are readily cut by our Model 170 Ultrasonic Disk Cutter
Align Interface of Interest
For the study of interfaces by transmission electron microscopy, it is critical to align the interface of interest parallel to the incident electron beam. One method for preparing such samples is to fabricate cross-section specimens. Typical cross-section specimens include composite materials, semiconductor devices (which often have multiple layers and thus multiple interfaces), and specimens with thin film layers.
XTEM specimen consisting of Co/Ru multilayers and a Ru buffer layer deposited by CVD on a sapphire substrate. Ion milling was conducted at a voltage of 4 kV, a current of 4 mA, and an incident milling angle of 7°.Image courtesy of K. Hono and D.H. Ping, National Institute for Materials Science, Japan
Fabricate Precise Cross-Section TEM Specimens
The XTEM Prep Kit makes it easy to stack and bond these wafers together. A small amount of vacuum-compatible epoxy is placed between each wafer. The wafers are then held in place by a vise assembly to produce a consistent epoxy layer thickness. The wafer stick is then cored with the ultrasonic disk cutter, and then inserted into brass tubes for subsequent sectioning into self-supported 3 mm diameter disk specimens.
By sectioning the sample and adhering together several layers, each containing an interface of interest, significant amounts of information can be obtained from one specimen. The Model 170 Ultrasonic Disk Cutter is equiped with all the components required to produce high-quality cross-section specimens for transmission electron microscopy (TEM).
Includes
- (1 each) Titanium Tool; 2.3 mm Diameter Disk
- (1 each) Titanium Tool; 4 mm x 5 mm Rectangular
- (1 each) Slice holder, 2 mm x 3 mm Rectangular
- (1 each) Slice holder, 4 mm x 5 mm Rectangular
- (3 each) Mixing dish
- (1 each) Stack Mounting Plate Assembly
- (2 each) PTFE (polytetrafluoroethylene) Mold
- (1 each) Spring-Type Vise Assembly
- (1 each) Glue Sticks; Crystalbond™ Adhesive, 12/pk
- (1 each) Brass tubes, 12/pk
Ordering
| 50188 | Model 180 XTEM Prep Kit | each | 2,080.00 | Add to Cart |
