Conductive
Silver Epoxy Kit
EMS #12642-14
Use this two part electrically conductive silver epoxy for adhering microscope samples and solderless connections and bonding in electric design, prototype and repair projects. Applications include circuit board repair, surface mount connections, static discharge, shielding and grounding. The material is ideal for solderless connections and bonding of heat sensitive components. The Conductive Silver Epoxy bonds aggressively to a wide variety of materials including solder, glass and copper.
Instructions
Mix equal amounts of the bright silver (Part A) epoxy with the gray silver (Part B) hardener. Mix thoroughly and apply with the reusable stir/applicator within 5 minutes. Make sure that the area to be bonded is clean and oil free.
Curing times and overall conductivity depend primarily on temperature. For fastest curing times, maximum conductivity and adhesion, heat the bond to between 150-250°F(65-121°C) for 5-10 minutes and allow to cool. Use a heat gun, hair dryer or oven for heating. Room temperature curing is possible in 4 hours at or above 75°F (24°C). Curing temperatures at below 75°F(24°C) will result in longer curing times and increased overall cured resistance. Maximum properties are achieved in twenty four hours.
Technical Information
Composite Properties:
| Material | Electrically conductive silver epoxy | |
| Thinner | Do not thin | |
| Color/Material | Part A: Bright silver epoxy Part B: Gray silver hardener |
Cured Properties:
| Volume Resistivity | <0.001 ohm-cm | |
| Thermal Conductivity | 11.0 BTU (in/F² hr°F) | |
| Moisture resistance | Good | |
| Temperature Range | -131 to 212°F (-55 to 100°C) | |
| Cured Flexibility | Fair | |
| Adhesion | Excellent | |
| Typical Thickness | 5 mil | |
| Chemical resistance | Excellent | |
| Lap shear | >1200 lbs (544 kg force) | |
| Shore hardness | >70 |
Use Procedures:
| Mix Ratio & Application | Mix equal amounts (1:1) by weight or volume. Non-critical. Mix thoroughly and apply to clean surface within 10 minutes. | |
| Cure: | Curing times and overall conductivity depend primarily on temperature. For fastest curing times, maximum conductivity and adhesion, heat the bond to between 150-250°F (65-121°C) for 5-10 minutes and allow to cool Room temperature curing is possible in four hours at above 75°F(24°C). For heating use a heat gun, hair dryer or oven. Curing at room temperature below 75°F(24°C) will result in longer curing times and increased overall cured resistance. Maximum properties are achieved in twenty four hours. |
|
| Pot life | 10 minutes @ 75°F (24°C). Apply within 10 minutes of mixing. | |
| Clean Up | Use a solvent before materials is fully cured. | |
| Shelf Life | Twelve months unmixed and unopened. |
WARNING
DO NOT TAKE INTERNALLY. Use only in well ventilated areas. May cause skin irritation. Avoid prolonged breathing of vapor. HARMFUL OR FATAL IF SWALLOWED. Additional technical sheets and/or Material Safety Data Sheets are available upon request.
KEEP OUT OF REACH OF CHILDREN. KEEP AWAY FROM EYES
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