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EMS Technical Data Sheets
Epo-Tek H20S Adhesive
EMS #12672-20S
Epo-Tek H20S Adhesive is a modified version of Epo-Tek H20E Adhesive, designed for die stamping and dispensing for chip bonding. It is very reliable, two component, silver-filled epoxy with a smooth thixotropic finish. Short curing cycles and convenient mix ratios prove this product to be very simple to use.
Technical Information
Composition Properties
| Number of components | Two |
| Mix ratio by weight | 1:1 |
| Specific gravity | Part A: 2.03 Part B: 3.07 (Frozen Syringe: 2.67) |
| Pot Life | 2.5 Days |
| Shelf Life | One year at 23°C (Frozen Syringe: One year at -40°C) |
Minimum Bond Line Cure Schedule
| 175°C | 45 seconds |
| 150°C | 5 minutes |
| 120°C | 15 minutes |
| 100°C | 2 hours |
| 80°C | 3 hours |
Please note that containers should be kept close when they are not being used. For filled systems, we recommend mixing the contents of container A and B very well before combining them.
Product Information