Specimen Support Grids are flat discs with mesh or holes used to hold thin sections of the specimen in position. EMS offers Specimen Support Grids in various grid types, from Veco Grids to Maxtaform Grids, Index Grids, and more. Most of the EMS Specimen Support Grids are manufactured without plastics, such as the C-flat™, which arrives clean and ready for use.
Lift-out Grids from EMS are meant for FIB applications, including accepting lamellae prepared by FIB or FIB-SEM systems. EMS offers Lift-out Grids, such as Omniprobe Lift-Out Grids and Carb-N-Grids. The Omniprobe Copper 5-Post Lift-Out Grids feature low profile sides, five post copper lift-out grids designed explicitly for in-situ lift-out, and multiple indexed mounting locations. The Carb-N-Grids™ 2 & 4 Post 3mm Lift-Out Grids are a durable carbon lift-out grid that facilitates precise Elemental Analysis.
Support Films on Grids are excellent options for helping with specimen preparation. EMS offers a complete range of Support Films for Transmission Electron Microscopy Grids. The Support Film on Grids includes options such as Formvar, Carbon, Formvar and Carbon, Formvar and Silicon Monoxide, and more.
Quantifoil Grids are also ideal for high-resolution cryo-EM data collection. EMS offers a variety of Quantifoil Grids, such as Quantifoil® Holey SiO2 Films, Quantifoil® with different hole shapes, and Quantifoil® R 5/20.
EMS provides a variety of Graphene TEM Grids that stop particles from passing through holes while still allowing the electron beam to intermingle with the specimen without any interference. Graphene TEM Grids available through EMS include Graphene Oxide on Holey Carbon Copper Mesh Grids, Graphene Oxide On Ultra-Flat Thermal SiO2, Graphene Oxide on Lacey Carbon 300 Mesh Copper TEM Grids, and more.
C-flat™ is an ultra-flat, holey carbon-coated TEM support grid for transmission electron microscopy (TEM). Unlike competing holey carbon films, C-flat™ is manufactured without plastics, so it is clean upon arrival and the user has no residue to contend with.