Questions? 800-523-5874 | [email protected]
- Prepmaster™ Specimen Preparation Robot
- TEM Grids
- TEM Window Grids
- Omniprobe Nanomanipulation Systems
- K-kit Wet "Liquid" TEM Kit
- Specimen Mounts
- SEM Specimen Holders
- Index and Finder SEM Grids
- SEM for Forensics
- SEM Sample Preparation Station Materials
- Cryogenic Personal Protection Equipment
- Cryo Dewars & Flasks
- Cryogenic Grids & Accessories
- Cryogenic Vials & Racks
- Cooling Chambers & Ice Baths
- Prepmaster™ Specimen Preparation Robot
- Laboratory Microwave Ovens
- LYNX II Automated Tissue Processor
- EMS Poly III
- Microtomes
- Tissue Slicers
- Rapid Immersion Freezer
- Heaters & Chillers
- SEM Cooling Stage
- Glow Discharge Systems
- Sputter Coaters & Carbon Coaters
- Stages
- Freeze Dryers
- Critical Point Dryers
- Cryo-SEM Preparation System
- Specimen Transfer Systems
- Decontaminators
- Desiccators
- Centrifuges
- Dry Baths
- Stirrers, Hot Plates
- Vortexers & Magnetic Mixers
- Rotators & Rockers
- Ovens & Incubators
- Vibration Isolation
- Air Sampling
- Vacuum Pumps
EMS Technical Data Sheets
Epo-Tek H22 Adhesive
EMS #12673-22
Epo-Tek H22 Adhesive is a two-component, silver-filled epoxy system made for die bonding and sealing hybrid circuit packages.
Technical Information
Composition Properties
| Number of components | Two |
| Mix ratio by weight | 100:4.5 |
| Specific gravity | Part A: 2.03 Part B: 1.03 |
| Pot Life | 16 hours |
| Shelf Life | Six months at room temperature |
Minimum Bond Line Cure Schedule
| 150°C | 5 minutes |
| 120°C | 10 minutes |
| 100°C | 20 minutes |
Please note that containers should be kept close when they are not being used. For filled systems, we recommend mixing the contents of container A and B very well before combining them.
Product Information