PRECISION DIAMOND WAFER BLADE, 3", MEDIUM, LOW

Precision Diamond Wafering Blades

Precision Diamond Cut-Off Wheels

These bonded blades are constructed of an inner metal core and an outer rim; this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements:

  • Low concentration (L/C) for sectioning hard and brittle materials, such as ceramics, silicon, glass, minerals
SKU: 50265-ML3
Pack: Each
$413.00