Includes clear ruler, fine tipped sharpe, sample handling tweezers, pen style diamond scriber, small sample pliers, and a carrying case. Good for thin and small samples. Lightweight and easy to use. Instructions included.
Three replacement diamond scribers for marking fine marks and scribing the wafer surface. Includes pen-style diamond scriber, fine scriber for precise marking and/or scribing, fine scriber with 30 degree tip for precise marking and/or scribing.
This is the best scriber you'll ever find for scribing semiconductor wafers. Lattice Scriber is the only scriber that has a 8-point truncated diamond tip that can be used for both toe and heel scribing held by a robust 4" long pin vise handle.
CleanBreak 6 inch wafer cleaving pliers. Simple and clean way to cleave (post scribe) wafers and wafer strips and smaller pieces. 3/4 inch jaw, opening. Comes with one set of replaceable jaws to maintain the best cleaving performance.
Custom, handheld cleaving pliers cleave small samples into pieces from 1-30 mm. Stainless steel covered with plastic handles for strong grip. Soft nylon covered jaws do not damage sample. Good for thin and small samples. Lightweight, easy to use.
Uses a novel sample holder and a cleaving platform to safely cleave samples into chips as small as 2x2mm. Repeatable cleaving of small samples without manual handling. Can be operated securely with gloved hands. Easy to use.
FlipScribe is a compact, stable, accurate, fast and low cost scribing and cleaving solution suitable for any lab; no utilities required. The length of the scribe can be varied from 1 mm to 100 mm. The tool is purely mechanical; no power required.
Precision cleaver that fits in the palm of your hand. Every user can cleave samples with wide variation of size, thickness and materials at high quality within 2 mins. Includes LatticeAx, 1 pre-installed indenter, vacuum pump, and transport case.
Accurate indent and cleaving system with high magnification imaging. Delivers 20 um accuracy with high quality cleaved surfaces in 5 mins. It integrates the LatticeAx base with an industrial platform customized for indenting and cleaving.
Highest performance cleaving solution. Integrates a custom designed, stable, small footprint workstation and vision package with 4um optical resolution and precise focus control to cleave with 10um accuracy in <5 minutes.
Custom diamond indenter for the LatticeAx. The LatticeAx indenter is easily replaced by the user and comes with screws, allen wrench and installation instructions. Polished end for improved positioning.