A temporary adhesive. These wash away adhesives are used as a temporary bond for holding delicate crystals, metallurgical specimens, glass components, and ceramic substrates for dicing, slicing, drilling and polishing. These materials adhere readily to metals, glass, ceramic and then can be washed after machining away using various solvents.
Sheet 10"x10" (254x254mm). Press down firmly to adhere substrate to film. No heating is required. Ideal for holding down silicon wafers, alumina, or glass substrates for scribing. Dissolves in acetone or MEK
Dry temporary film, 0.003" thick. Easily cut and place where needed. Melts at 195-210°F. Dissolves in trichloroethylene or toluene. Use for uniform bonding and flatness such as bonding stacks of substrates including LCD glass.
Blue plastic, non-hardening putty easily positions difficult materials at an angle during specimen preparation. Easily moldable and reusable, the putty will not permanently stick to solid samples or mounts.
The mounting wax is used to temporarily bond samples during a processing application. After processing, the mounting wax is washed away in acetone leaving no residue. Softening point is 71 deg C, Flow point is 135 deg C,
Designed as a masking material in jet polishing applications. Chemically inert, resistant to etching solutions, and can be easily removed with hydrocarbon or chlorinated solvents. Moderate Hardness and a Melting Point of 100° C.
Translucent in thin films. For sawing, ultrasonic cutting, lapping and polishing. Use on vitreous and piezoelectric materials, polished metal, semiconductors with large contacted areas. Chemical resistant. Melting Point of 80°C.
Environmentally safe powder compound for the removal of mounting waxes in semiconductor processing. Compatible for use on silicon, glass, iron, aluminum, zinc, brass, copper, magnesium and other materials.
This extraordinary mountant can be used as a temporary or permanent bond. The pen is composed of a fiber tip allowing for even and reproducable application. Free from any solvents, the base of the glue is acrylic. Can be used in SEM applications.
Fast drying, ultrathin clear adhesive suitable for mounting small particles which can be submerged in other adhesives. It can be diluted with methyl ethyl ketone. Quick-drying. Comes in a bottle with an applicator brush. 14 ml.
Loctite™ 460 is a quick curing low viscosity glue that be used for mounting samples to any substrate (glass, metal and/or plastic). It is soluble in acetone. Comes in an applicator-tipped plastic bottle – 20g.
This 5 minute curing epoxy is perfect for most applications where you want to fill a gap quickly. Bond most materials such as steel, aluminum, glass, wood, ceramic and most plastics. Works indoors and outdoors with a bond strength of 3300 PSI.