Precision Diamond Wafer Blade, 7", Coarse Low
Precision Diamond Wafering Blades
Precision Diamond Cut-Off Wheels
These bonded blades are constructed of an inner metal core and an outer rim; this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements:
- Low concentration (L/C) for sectioning hard and brittle materials, such as ceramics, silicon, glass, minerals
SKU:
50266-CL7
Pack:
Each