300 nm, 130 x 130 x 25 Layout, 0.6 µm Pitch

Holey Silicon Nitride TEM Grids

State-of-the-art support film.

This latest addition to our line of TEM Window Grids is manufactured using advanced MEMS technology to produce a unique 500 x 500 micrometer aperture with 200 nm low-stress silicon nitride membrane.

Available with square holey pattern or 5 x 5 indexed array with hexagonal holey film.

Features

  • Resistant to acids, bases, and solvents.
  • Can be easily plasma-cleaned to remove organic contamination.
  • Tolerates high-temperature experiments and imaging up to 1000°C.
  • Provides a carbon-free background.
  • Packaged under cleanroom conditions.

Specifications

Membrane Thickness 200 nm
Window Size 0.5 x 0.5 mm
Frame Thickness 200 µm

Nanoporous

Hole Size Layout Total No. Pitch Porosity
300 nm 130 x 130 x 25 422,500 0.6 µm 22.3%
SKU: 76043-73
Pack: 10 Pack
$461.00