| Physical Properties |
| Color: |
Part A: silver; Part B: silver |
| Consistency: |
Smooth, thixotropic paste |
| Viscosity (@ 100 RPM / 23°C): |
2,200-3,200 cPs |
| Thixotropic Index: |
3.69 |
| Glass Transition Temp (Tg): |
≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min) |
| Coefficient of Thermal Expansion (CTE): |
Below Tg: 31 x 10-6 in/in/°C
Above Tg: 158 x 10-6 in/in/°C |
| Shore D hardness: |
75 |
| Lap Shear Strength @ 23°C: |
1,475 psi |
| Die Shear Strength @ 23°C: |
>5 kg / 1,700 psi |
| Degradation Temp (TGA): |
425°C |
| Weight Loss: |
@ 200°C: 0.59%
@ 300°C: 1.67%
@ 250°C: 1.09% |
| Operating Temp: |
Continuous: -55°C to 200°C
Intermittent: -55°C to 300°C |
| Storage Modulus @ 23°C: |
808, 700 psi |
| Ion: |
Cl- 73 ppm
Na+ 2 ppm |
NH4+ 98 ppm
K+ 3 ppm |
| Particle Size: |
≤45 microns |
| Electrical Properties: |
| Volume Resistivity @ 23°C: |
≤0.0004 Ohm-cm |
| Thermal Properties |
| Thermal Conductivity: |
2.50 W/mK |
| |
29 W/mK, Based on Thermal Resistance Data: R = L x K-1 x A-1 |
| Thermal Resistance: (Junction to Case): |
TO-18 package with nickel-gold metalized 20 x 20 mil chips and bonded with Epo-Tek H20E (2 mil thick)
Epo-Tek®H20E: 6.7 to 7.0°C/W
Solder: 4.0 to 5.0°C/W |