ETC Bond 568

Thermally conductive adhesive, Aluminum filled, 1:1 epoxy paste, Excellent mechanical strength to 400 deg F.

Properties Thermally Conductive

Filler Aluminum
Mix Ratio by Weight: Resin : Hardener 1:1
Mixes Specific Gravity, g/cc @ 25°C .85
Mixes Viscosity, @ 25°C, cps Paste
Pot Life, 100g mass @ 25°C, hrs. 4.0
Recommended Cure, hr/°F 2/200
Alternative Cure, hr/°F 24-48/RT
Temperature Resistance, °F (°C) 400 (204)
CTE, in/in/°F x 106 (°C) 33.0 (60.0)
Thermal Conductivity, Btu-in/hr-ft2-°F 9.0
Tensile Shear Strength, psi * 1,400
Volume Resistivity, ohm-cm 1.0 x 105
Dielectric Strength, volts/mil 80
Chemical Resistance Excellent
Color Grey
SKU: 50380-568
Pack: 2 x 25 g
$45.50