ETC Bond 805

Thermally conductive adhesive, Aluminum filled, Two part epoxy paste, Low shrink rate, Excellent mechanical strength to 570 deg F.

Properties Thermally Conductive

Filler Aluminum
Mix Ratio by Weight: Resin : Hardener 100:12
Mixes Specific Gravity, g/cc @ 25°C 1.66
Mixes Viscosity, @ 25°C, cps 85,000
Pot Life, 100g mass @ 25°C, hrs. ≤1.0
Recommended Cure, hr/°F 2/100+2/200
Alternative Cure, hr/°F 24-48/RT
Temperature Resistance, °F (°C) 572 (300)
CTE, in/in/°F x 106 (°C) 25.0 (45.0)
Thermal Conductivity, Btu-in/hr-ft2-°F 12.5
Tensile Shear Strength, psi * 1,200
Volume Resistivity, ohm-cm 1.0 x 1014
Dielectric Strength, volts/mil 50
Chemical Resistance Good
Color Grey
SKU: 50380-805
Pack: 2 x 25 g
$44.50