The HPT-100 is a microprocessor-controlled benchtop plasma treatment system which is ideally suited to surface activation, cleaning, and modification of a wide range of materials including polymers, metals, glass, and ceramics.
The HPT-100 is able to handle a wide range of gases for optimized treatments, including air, oxygen, hydrogen, argon, nitrogen and many others.
Benefits |
- Compact benchtop unit
- User friendly TFT interface
- Recipe store
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- Fast treatment time
- Precise & repeatable
- No hazardous emissions
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Plasma Environment
The HPT-100 features a 100mm diameter plasma process chamber in stainless steel with vacuum compatible materials throughout.
The proprietary, high stability HPS plasma generator is continuously variable over the entire 0–100W power range rather than being limited to discreet levels, delivering much finer control when processing delicate materials.
Process Control
The 5.7 inch color touchscreen provides a rich, user-friendly interface. Variables such as gas flow rate, pressure, power level and plasma processing time can be freely set and then stored to produce a fully interlocked process cycle from a single keypress.
A handy status display and end of process audible alarm informs the user of every step in the process.
Repeatable & Reliable
With precision digital mass flow controllers and integrated pressure gauge, the HPT-100 delivers unmatched reliability and repeatability by removing common errors in gas flow and gas type settings which will be familiar to users of equivalent equipment that utilize manual needle valves. Convenient recipe store software, a unique feature, allows fixed repeatability.
Versatile
Recipe store allows users to select and store up to four recipes. Each recipe contains unique settings for power level, plasma process time, and pressure. The base model HPT-100 has a single gas inlet. The unit is prepared so that an optional second gas or vapor delivery inlet can be added at a later time if required.
Applications |
- Plasma cleaning
- Plasma surface activation to improve adhesion
- Functional plasma coating
- Plasma etching
- PDMS & microfluidic
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- PEEK & other engineering polymers
- PTFE
- Metals
- Ceramics
- Glass & optical devices
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Specifications |
Enclosure |
Dimensions |
520mm (W) x 286mm (H) x 550mm (L), (+50mm on rear for cables) |
Weight |
~22kg |
Chamber |
Material |
Stainless Steel |
Form |
Cylindrical |
Dimensions |
100mm dia. x 280mm (L) |
Removable Parts Carrier |
Material |
Aluminum |
Form |
Flat tray |
Dimensions |
90mm (W) x 255mm (L) |
Plasma Power Supply |
Power |
0–100W, continuously variable output |
Frequeny |
40 kHz |
Process Control |
Interface |
5.7” Color TFT with recipe store |
Gas Channel Options |
Fixed, x1 MFC |
Vent inlet |
x1 |
Connections |
6mm compression |
Process Timer |
1sec – 99.59min |
Recipe Store |
Stores up to 4 x recipes - with individual parameters |
Pressure Gauge |
Pirani sensor |
Services |
Electrical |
90–250 VAC, 50–60Hz, 1200–1500 VA/ (including pump), fused 6.3 A T / 10 A T |
Powet Cord |
Suited to region |
Compliance |
CE – UKCA - ROHS - WEEE |