Scribing Machine

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FlipScribe™

FlipScribe™ takes scribing to a new performance level, making clean, straight scribe lines on the back side to accurately cleave front side targets, bonded wafers and other substrates. This method eliminates contamination of sensitive front side devices during the scribing processes and is valuable for both crystalline and amorphous samples.

Faceted diamond scribe; blue line across cutting edge

Silicon device after scribing and cleaving


FlipScribe has a small footprint, allowing it to be placed on any work surface

Scribing Reinvented

FlipScribe is a compact, stable, accurate, fast and low cost scribing and cleaving solution suitable for any lab; no utilities required. It provides a more accurate method for scribing than can be achieved with hand held tools, by integrating a robust diamond scribe into a sample platform with a fence guide design. Time required to align and scribe is about a minute. It allows users to accurately position the scribe mark relative to features on the front side, visualized either by eye or with a user-supplied high magnification microscope. FlipScribe also offers a quick method for cleanly downsizing large samples, with a "scribe stop" to allow the operator to define the length of the scribe.

Benefits

• Enables accurate cleaving through frontside targets with a scribe made on the backside of the substrate
• Scribe does not damage the frontside of the sample
• Accuracy of scribe ±200 µm (achievable)
• Flexible with respect to sample size and shape
• Capable of scribing bonded crystalline and amorphous wafers and chips for subsequent cleaving
• No maintenance required

Features

• Accurate positioning of the scribe relative to features on the front side (the front side being observed either by eye or with a stereoscope)
• The length of the scribe can be varied from 1 mm to 100 mm
• Prealigned diamond scribe in user replaceable cartridge; height and angle adjustable
• Ruler embedded in platform enables precise and repeatable sample alignment and sizing
• The tool is purely mechanical; no power required

Specifications

Configuration

Installment Requirements

Options

Accessories

7670-01	7670-08	7670-03
7670-04	7670-05	7670-06

Ordering

Cleaving Kit Extension for FlipScribe

Attaches to FlipScribe rails.

The FlipScribe extension is an L-shaped bracket used to support wafer holders and large samples during the scribing process.

FlipScribe Holder for Small Samples

Designed for samples with parallel edges.

The plastic holder grips samples from its edges. Sizes can be varied by sliding the gripper on the guide pins.

No screws are needed!

It holds samples from 5 to 25 mm (0.2 to 1") and 200 to 800 microns thick.

It can also be used to grip scribed samples for cleaving with the Small Sample Pliers (Cat. #7647). Simply flip the sample over after scribing and cleave with the pliers.

View the video to the right which shows how to use the FlipScribe Holder for Small Samples.

FlexScribe Station

For small samples – up to 200 mm wafers

The FlexScribe Station is a flexible and affordable scribing workstation for dicing, downsizing, extracting and cross-sectioning. It will accept any shape or thickness and any material from glass to silicon.

Features

• Integrated carbide wheel scriber
• Integrated, ruled (metric & inches) for position and alignment
• Integrated self-healing cleaving mat to support and protect the wafer/sample
• Integrated work table with non-skid feet to prevent movement during the scribing process
• Ceramic coated slide-shaft for smooth and easy scribing
• Slide shaft and scribe cartridge enable repeatable, long, straight scribes
• No power, no maintenance, easy to clean with minimal consumables

Accessories

Scriber

Diamond Scribing Wheel

Deep Cutting Wheel

Cleaving Mat

Ordering

High Accuracy Cleaving Systems