The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving. This kit is suitable for a wide variety of substrates and wafers (Si, GaAs, glass). The standard configuration includes one each:
- Diamond Scribe-Pen style
- Diamond Scribe-straight tip
- Diamond Scribe- 30 degree tip
- Tweezers with black soft fiber fine tip (length 6¼")
- CleanBreak Pliers-Cleaving pliers.
- Clear plastic ruler with metric and US units
- Tungsten cleaving wire
Optional Cleaving Kit with Mat
The kit includes a large, 12x18" wafer mat.
Note: Always remember to use safety glasses when cleaving the wafer.