Precision Diamond Wafer Blade, 3", Medium, High

Precision Diamond Wafering Blades

Precision Diamond Cut-Off Wheels

These bonded blades are constructed of an inner metal core and an outer rim; this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements:

  • High Concentration (H/C) for general laboratory use, either low or high saw's speed
SKU: 50265-MH3
Pack: Each
$442.00