Precision Diamond Wafer Blade, 4", Coarse High
Precision Diamond Wafering Blades
Precision Diamond Cut-Off Wheels
These bonded blades are constructed of an inner metal core and an outer rim; this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements:
- High Concentration (H/C) for general laboratory use, either low or high saw's speed
- Low concentration (L/C) for sectioning hard and brittle materials, such as ceramics, silicon, glass, minerals
SKU:
50267-CH4
Pack:
Each