The Q300T T Plus is a large chamber, turbo-pumped coating system, ideally suited for sputtering a single large diameter specimen up to 150mm. Ideal for high resolution SEM, large samples e.g Silicon Wafers, protective platinum layers for FIB, and carbon coating for elemental analysis and TEM
| Key Features |
- Capable of achieving vacuum of 5x10-⁵ mbar
- Single sputter head allows coating of samples up to 150mm Ø
- Touch and swipe capacitive screen
- USB port for upgrades and download of process log files
- Capable of sputtering non-oxidizing and oxidizing metals e.g. Cr, Ir, W, Al, Ti, Au, Pt
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- Multiple-user profiles can be set up on one instrument
- 16GB of memory can store more than 1000 recipes
- Multi-colour LED visual status indicator
- 1 x Chromium target as standard
- Capable of carbon rod evaporation (carbon fiber evaporation available as option)
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Recommended applications for Q300T ES Plus:
- High resolution SEM
- Large samples e.g Silicon Wafers (up to 150 mm)
- Protective platinum layers for FIB
- Carbon coating for elemental analysis and TEM
These products are for Research Use Only.
Detachable chamber with built-in implosion guard
Removable glass chamber and easily accessible base and top plate allows for an easy cleaning process. Users can rapidly change the chamber, if necessary, to avoid cross contamination of sensitive samples. Tall chamber option is available for improved uniformity for sputtering and to hold larger substrates.
Safety
The Q300T ES Plus meets key industry CE standards
- All electronic components are protected by covers
- Implosion guard prevents user injury in event of chamber failure
- Vacuum interlocks remove power from deposition sources to prevent user exposure to high voltage in event of chamber being opened
- Overheating protection shuts down power supply
Vacuum control
High vacuum turbo pumping allows sputtering of a wide range of oxidizing and non-oxidizing metals for thin film and electron microscopy applications. Automatic vacuum control which can be pre-programmed to suit the process and material, therefore removing the need for manual intervention or control.
Cool magnetron sputtering
Sputter coating is a technique widely used in various applications; it is possible to create a plasma and sputter metals with high voltage, poor vacuum and no automation. However, this is not suitable for electron microscopy applications because it can heat the sample and result in damage when the plasma interacts with the sample. The Q300T ES Plus uses low temperature enhanced-plasma magnetrons optimized for the turbomolecular pump pressures, combined with low current and deposition control, which ensures your sample is protected and uniformly coated.
The Q300T ES Plus uses easy-change, 57 mm diameter, disc-style targets which are designed to sputter oxidizing and noble metals. The Q300T ES Plus is fitted as standard with a chromium (Cr) sputter target. Other targets options include; Cr, Ir, W, Al, Ti, Au, Pt, etc.
Pulsed cleaning for aluminum sputtering
Aluminum (Al) rapidly forms an oxide layer which can be difficult to remove. The Q300T ES Plus has a special recipe for Aluminum that reduces the oxide removal time and prevents excessive pre-sputtering of the target
Film thickness monitor
The Q300T ES Plus can be fitted with an optional film thickness monitor (FTM), which measures the coating thickness on a quartz crystal monitor within the chamber, in order to control the coating thickness of material deposited on to the sample.
| Specifications |
| Instrument Case |
590mm W x 535mm D x 420mm H (maximum height during the opening of the coating head: 772mm) |
| Weight |
36 kg (packed: 59kg) |
| Packed Dimensions |
730 mm W x 630 mm D x 690 mm H |
| Work Chamber |
Borosilicate glass with integral PET implosion guard Size 300 mm outside diameter x 127 mm High |
| User Interface |
Full graphical interface with touch screen buttons, includes features such as a log of the last 1000 coatings and reminders for when maintenance is due |
Specimen Stage
A flat adjustable stage capable of accepting either 4” or 6” wafers is mounted on a swinging arm stage, which rotates the stage under the targets to optimise coating. Rotation speed is variable from 14rpm to 38rpm |
| Ultimate Vacuum |
5 x 10-5 mbar* |
| Sputter Vacuum Range |
5 x 10-2 to 5 x 10-3 mbar* |
| *Typical ultimate vacuum of the pumping system in a clean instrument after pre-pumping and venting with dry nitrogen gas |
| Sputter Target |
Disc-style 57 mm Ø. A 0.5 mm thick chromium (Cr) is fitted as standard. |
| Visual Status Indicator |
A large status multi-color indicator light provides a visual indication of the state of the equipment, allowing users to easily identify the status of a process at distance. |
The indicator LED shows the following status:
- Initialization
- Process running
- Idle
- Coating in progress
- Process completed
- Process ended in fault condition
Audio indicator also sounds on completion of the process
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| Services |
| Gases |
process gas argon, 99.999% Nominal 5 psi |