Square 500 Mesh Cu 100/vial

3 mm diameter, 0.75 mil thickness
Material: Copper/Rhodium (Cu/Rh = CR)

High Grade Maxtaform grids with clean and smooth edges, firm support, and a large open area. Copper/Rhodium grids with one surface coated with inert Rhodium. This coating will eliminate tarnishing, give side identification, and reduce the bar thickness.

    Technical Data
Type Packed Pitch µ Hole µ Bar µ
500 mesh 100/vial 51 28 23
SKU: M500-Cu
Pack: 100 Vial
A: 51
B: 28
C: 23
Products specifications
Attribute name Attribute value
Mesh 500
Material Copper