CD-flat™ for Automated S/TEM Imaging and Metrology

Now Available

CD-flat™ is designed for CD-TEM metrology of large specimens, like 3D NAND FIB lamella.

Grid Material	Copper Grid
Mesh Size	200 or 300 Mesh
OD	3.05 mm
Film Material	Holey Carbon
Film Thickness	40 nm thick
Hole Pattern	8/2 hole pattern (8 um diameter, 2 µ spacing between holes)

Supplier: Electron Microscopy Sciences

A: Hole Size, B: Hole Spacing, C: Mesh, D: Grid

Cat #	Description	A	B	C	D	Pack	Price	Quote	Quantity
Cat #: CDFT822-50	Description: CD-Flat™, Holey Carbon, Large Specimen, 200 Mesh	A: 8.0 µm	B: 2.0 µm	D: 200	D: Cu	Pack: 50 Pack	Price: $530.00	Add to Quote:
Cat #: CDFT823-50	Description: CD-Flat™, Holey Carbon, Large Specimen, 300 Mesh	A: 8.0 µm	B: 2.0 µm	D: 300	D: Cu	Pack: 50 Pack	Price: $530.00	Add to Quote: