CD-flat™ for Automated S/TEM Imaging and Metrology
Now Available
CD-flat™ is designed for CD-TEM metrology of large specimens, like 3D NAND FIB lamella.
Specifications
| Grid Material |
Copper Grid |
| Mesh Size |
300 Mesh |
| OD |
3.05 mm |
| Film Material |
Holey Carbon |
| Film Thickness |
40 nm thick |
| Hole Pattern |
8/2 hole pattern (8 um diameter, 2 µ spacing between holes) |