ETC Bond 597

Electrically and thermally conductive adhesive, Silver filled. One part system, Inorganic system for bonding applications up to 1200 deg F.

Properties Electrically/Thermally Conductive

Filler Silver
Mix Ratio by Weight: Resin : Hardener NA
Mixes Specific Gravity, g/cc @ 25°C 2.3/2.1
Mixes Viscosity, @ 25°C, cps Paste/Paste
Pot Life, 100g mass @ 25°C, hrs. N/A
Recommended Cure, hr/°F 2/RT+2/200
Alternative Cure, hr/°F --
Temperature Resistance, °F (°C) 1200 (649)
CTE, in/in/°F x 106 (°C) 9.6 (17.3)
Thermal Conductivity, Btu-in/hr-ft2-°F 63.1
Tensile Shear Strength, psi * --
Volume Resistivity, ohm-cm 0.0002
Dielectric Strength, volts/mil
Chemical Resistance Excellent
Color Silver
SKU: 50380-597
Pack: 5 g