Model 302-EDU, 300 nm, unmounted

Overall Benefits:

  • Easier testing of your SPM.
  • Improved accuracy of critical dimension measurements.
  • Accuracy: 0.5% (1 std. dev.).

Features and Benefits:

  • Holographic fabrication - assures high accuracy and precision.
  • Pattern height > 100 nm - provide excellent image contrast.
  • Uniform coverage of entire chip - save time (can image anywhere).

Description:

  • Nominal calibrated dimensions: 300 or 700 nm.
  • Calibration certificate: supplied with each sample, stating the dimension to the nearest 1 nm.
  • Pattern types: 1- or 2—Dimensional. The calibrated dimension is the same for both axes for the 2-D standard.
  • Feature geometry:
    -parallel ridges (1-D, 300 or 700 nm)
    -cylindrical posts (2-D 300 nm)
    -diamond-shaped posts (2-D 700 nm)
  • Physical Size: 3 mm x 4 mm x 0.5 mm.
  • Substrate: Silicon wafer.
  • Top surface: Tungsten film.

The 1-D standards can be scanned using any AFM mode, including contact mode. The 2-D standards can be scanned using modes such as Tapping Mode™, intermittent contact, and non-contact.

Model 302-EDU

Student grade calibration specimen. 2-dimensional, 297 nm nominal period. Aluminum bumps on Si.

References

1. Pereira, D.E.D. & Claudio-da-Silva, Jr., E. “Improvement of AFM as an analytical Instrument for Residual Lignin Characterization” in: Proceedings International Symposium on Wood and Pulping Chemistry, Helsinki, Finland, June 1995.

2. Pereria, D.E.D, Chernoff, D., Claudio-da-Silva, Jr. E., & Cemuner, B.J., “The use of AFM to investigate the delignification process: Part I –AFM performance by differentiating pulping processes”, to be published.

Student grade calibration, Array of Posts, nominal pitch 297 nm, 2-dimensional, Al bumps on Si. Use contact or TappingMode.

SKU: 80124-EDU
Pack: Each
$468.00
Products specifications
Attribute name Attribute value
Material Al bumps on Si