Silicon Wafer, Type P, 1"

These silicon wafers can be used for substrate studies or as substrate for AFM and SEM samples by cleaving the wafer.


Material: Silicon
Diameter: 25 mm
Orientation: <100>
Resistance: 1-30 Ohms
Type P: Boron - 1 primary flat
SiO2 top coating: None
Wafer Thickness: 10-12 mill (254-304µm)
Roughness: 2 nm
TTV: <2 0µm
Polished: on one side
SKU: 71893-04
Pack: Each
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