Silicon Wafer, Type P, 3"
These silicon wafers can be used for substrate studies or as substrate for AFM and SEM samples by cleaving the wafer.
Specifications
|
3" |
Material: |
Silicon |
Diameter: |
76 mm |
Orientation: |
<111> |
Resistance: |
1-30 Ohms |
Type P: |
Boron - 1 primary flat |
SiO2 top coating: |
None |
Wafer Thickness: |
13.6-18.5 mill (345-470µm) |
Roughness: |
2 nm |
TTV: |
|
Polished: |
on one side |