Epo-Tek® H20S is a modified version of Epo-Tek®H20E. Epo-Tek® H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency (mixing ratio 1:1). This modified version offers high electrical conductivity, short curing cycles, proven reliability, and the convenient mix ratio, Epo-Tek® H20S is extremely simple to use. Epo-Tek® H20S pot life is 2.5 days and shelf life is one year when store at room temperature.
Maximum Bond Line Cure Schedule:
Typical properties: (to be used as a guide only, not a specification)
| Physical Properties |
| Color: |
Part A: silver; Part B: silver |
| Consistency: |
Smooth, thixotropic paste |
| Viscosity (@ 100 RPM / 23°C): |
1,800-2,800 cPs |
| Thixotropic Index: |
5 |
| Glass Transition Temp (Tg): |
≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min) |
| Coefficient of Thermal Expansion (CTE): |
Below Tg: 31 x 10-6 in/in/°C
Above Tg: 120 x 10-6 in/in/°C |
| Shore D hardness: |
57 |
| Lap Shear Strength @ 23°C: |
1,240 psi |
| Die Shear Strength @ 23°C: |
≥5 kg / 1,700 psi |
| Degradation Temp (TGA): |
414°C |
| Weight Loss: |
@ 200°C: 0.40%
@ 300°C: 1.37% |
@ 250°C: 0.60% |
| Operating Temp: |
Continuous: -55°C to 200°C
Intermittent: -55°C to 300°C |
| Storage Modulus @ 23°C: |
339,720 psi |
| Ion: |
Cl- 162 ppm
Na+ 0 ppm |
NH4+ 282 ppm
K+ 4 ppm |
| Particle Size: |
≤20 microns |
| Electrical Properties: |
| Volume Resistivity @ 23°C: |
≤0.0005 Ohm-cm |
| Thermal Properties |
| Thermal Conductivity: |
3.25 W/mK |