Epo-Tek® H22 is a two component, silver-filled epoxy system. Mixing ratio of silver resin paste and liquid hardener is 100:4.5. Pot life 16 hours, and shelf life is 6 months at room temperature.
Maximum Bond Line Cure Schedule:
Epo-Tek® H22 features:
- Smooth, free-flowing, slightly thixotropic paste
- High Tg allows it to be used for high temperature applications (≤300°C)
- Contains no solvents – It is a NASA approved low outgassing epoxy
- Excellent resistance to solvents, chemicals and moisture
- Extended pot life and fast curing at low temperature <100°C
- Designed for die bonding and sealing hybrid circuit. Recommended for SEM small angle cleavage and wafer bonding
Typical properties: (to be used as a guide only, not a specification).
| Physical Properties |
| Color: |
Part A – silver; Part B – amber |
| Consistency: |
Smooth, flowing paste |
| Viscosity (@ 100 RPM / 23°C): |
12,000-20,000 cPs |
| Thixotropic Index: |
2.36 |
| Glass Transition Temp (Tg): |
≥100°C (Dynamic cure 20-200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min) |
| Coefficient of Thermal Expansion (CTE): |
Below Tg: 39 x 10-6 in/in/°C
Above Tg: 224 x 10-6 in/in/°C |
| Shore D hardness: |
80 |
| Lap Shear Strength @ 23°C: |
1,980 psi |
| Die Shear Strength @ 23°C: |
≥5 kg / 1,700 psi |
| Degradation Temp (TGA): |
454°C |
| Weight Loss: |
@ 200°C: 0.09%
@ 300°C: 1.42% |
@ 250°C: 0.23% |
| Operating Temp: |
Continuous: -55°C to 250°C
Intermittent: -55°C to 350°C |
| Storage Modulus @ 23°C: |
540,120 psi |
| Ion: |
Cl- 175 ppm
Na+ 60 ppm |
NH4+ 148 ppm
K+ 6 ppm |
| Particle Size: |
≤45 microns |
| Electrical Properties: |
| Volume Resistivity @ 23°C: |
≤0.005 Ohm-cm |
| Thermal Properties |
| Thermal Conductivity: |
0.94 W/mK |