These knives are available in 35, and 45° angles. The optimal thickness range for cutting with these knives is between 30-150 nm. They are available in sizes ranging from 1.5 mm-4.0 mm as a standard. Other sizes are available upon request. All of these knives are tested within a thickness range of 30-150 nm. Whether your needs are biological or materials related, in EM or LM, we have a knife to suit your needs.
Recognized as the knife for routine sectioning. It is a good compromise between section quality and durability.
The 45° knife is recommended for the sectioning of extremely hard and brittle materials such as ceramics. In this domain it has replaced the formerly recommended 55° knife.
Ultra 35° Wet
The capabilities of the 35° diamond knives have been shown in two publications by J.Jésior (Ref 3, 4). He proved markedly reduced compression, smoother section surfaces and better structural preservation with the use of our 35° diamond knives.
In the meantime a great number of scientists have noticed and recognized the advantages of the 35° knives for the sectioning of Lowicryls, inhomogeneous samples such as undecalcified bone, dental materials, etc.
The 35° knives have proved advantageous in the sectioning of soft industrial samples such as metals and polymers, as well as for hard and brittle samples, for example semiconductors (Si, GaAs, etc), superconducting oxides, nanocrystalline ceramics.
The use of 35° knives leads to reduced compression in soft samples and to less breaking in hard and brittle samples.
We can claim that the 35° diamond knife has proved it's capability as a routine knife for many applications.
Similar to our ultra 35° 3.0 mm with a greater thickness range (50-500 nm).
Ultra 35° Maxi
Similar to our ultra 35° 4.0 mm with a larger boat.
Ultra 35° Dry
The ultra 35° knife (in the triangular holder) with a thickness range of 30-200nm is used for dry sectioning of epoxy or acrylic resin embedded biological samples, which need to be investigated by element analysis (Ref. Edelmann) and SIMS (Ref. Guerquin-Kern). The gliding of the sections on the dry knife surface is facilitated with the use of our Static Line II ionizer.
The Ultra Diamond knife is now available in Jumbo with 35° and 45° angles and in 2.0mm and 3.0mm sizes.
The Ultra ATS Diamond knife is perfect for placing sections on Si wafers to view under the SEM. The knife comes in 3.0mm size with 35° angle. Please see the Technical Data Sheet for an illustration showing the technique of placing sections on a wafer.